(4）亞胺二碳酸法
(4) imine two carbonate method

　　三酸酐的酰氯與芳族二胺反應(yīng)制備聚酰胺-酰亞胺是一種重要的方法，其工藝如下：
Three benzene anhydride chloride with two amine was prepared by the reaction of aromatic polyamide imide is an important method, the process is as follows:

　　反應(yīng)釜內(nèi)加入定量的4，4′-二氨基聯(lián)醚、二甲基、二，啟動(dòng)攪拌。待物料全部溶解后，再加入1，2，4-偏三甲酸酰氯。反應(yīng)溫度控制在25～35℃。當(dāng)粘度達(dá)大值時(shí)，用二甲基和二稀釋。然后，用環(huán)氧乙烷中和發(fā)應(yīng)副產(chǎn)出，可得到可溶性的聚酰胺-酰胺酸預(yù)聚體。若將此預(yù)聚體在高溫下脫水環(huán)化，即可制得不熔不溶的聚酰胺-酰亞胺。
The reaction kettle with quantitative 4, 4 '- two amino diphenyl ether, two dimethyl acetamide, xylene, start stirring. The material is completely dissolved, add 1, 2, three 4- trimellitic acid chloride. The reaction temperature is controlled at 25 ～ 35 ℃. When the viscosity of the maximum value, diluted with two methyl acetamide and xylene. Then, by epoxy ethane and hair should be pair of output can be obtained hydrochloric acid, soluble polyamide amide acid prepolymer. If this prepolymer dehydration at high temperature, cyclization, acyl polyamide can be prepared insoluble and infusible imine.

3、理化性能
3, physical and chemical properties

　　聚酰胺-酰亞胺的強(qiáng)度是當(dāng)今上任何工業(yè)未增強(qiáng)塑料不可比擬的，其拉伸強(qiáng)度超過(guò)172MPa，在1.8MPa負(fù)荷下熱變形溫度為274℃。
Polyamide imide strength is one of the world's industrial not reinforced plastic incomparable, the tensile strength is more than 172MPa, in the 1.8MPa load and thermal deformation temperature of 274 ℃.

　　Torlon聚合物在制造后還可能進(jìn)行固態(tài)聚合物，通過(guò)后固化增加分子量提供更優(yōu)良的性能。后固化在260℃下發(fā)生，固化所需的時(shí)間和溫度主要取決于零件的厚度和形狀。
Torlon polymer after fabrication may also be solid polymer, the molecular weight increased after curing provides better performance. After curing at 260 ℃, temperature and curing time required depends mainly on the part thickness and shape.

　　它可在220℃下長(zhǎng)期使用，300℃下不失重，450℃左右開(kāi)始分解。其粘接性、柔韌性及耐堿性更佳，可與環(huán)氧樹脂互混交聯(lián)固化，耐磨性良好。
It can be used for a long time at 220 ℃, 300 ℃ not weightless, 450 ℃ begins to decompose. The adhesion, flexibility and resistance to alkali is better, with epoxy resin mixed curing, good wear resistance.

4、加工成型
4, processing

　?。?）模塑
(1) molding

　　注射成型前應(yīng)將料進(jìn)行預(yù)干燥。干燥條件為150℃、8小時(shí)。料筒溫度上限為360℃，模加工溫度為200℃。注射壓力盡量大，關(guān)閉增壓泵后降至保壓14～28MPa，背壓為0.3MPa。后固化時(shí)間，在170～260℃條件下，約三天左右。
Before injection molding material should be pre drying. Drying temperature is 150 ℃, 8 hours. The upper barrel temperature is 360 ℃, die temperature was 200 ℃. The injection pressure is as large as possible, close the booster pump to the pressure of 14 ~ 28MPa, back pressure is 0.3MPa. After the curing time, at 170 ~ 260 ℃, about three days.

　　(2）薄膜
(2) thin film

　　聚酰胺-酰亞胺薄膜采用連續(xù)浸漬法制備。用400mm寬、0.05mm厚的鋁箔作連續(xù)載體。浸有預(yù)聚體溶液的鋁箔進(jìn)入立式烘爐，于190℃下烘干，以除去溶劑。然后，于200～210℃下處理2～4小時(shí)，使預(yù)聚體膜脫水環(huán)化。待冷卻后，將薄膜由鋁箔上剝下即可。
Polyamide imide films by continuous impregnation. Using 400mm wide, 0.05mm thick aluminum foil as a continuous carrier. Dip a prepolymer solution of aluminum foil into the vertical oven, drying at 190 ℃, to remove the solvent. Then, in the 200 ~ 210 ℃ for 2 to 4 hours, the prepolymer membrane dehydration cyclization. After cooling, the film is made of aluminum foil stripping.

　　
5、應(yīng)用領(lǐng)域
5, application

　　聚酰胺-酰亞胺具有優(yōu)良的機(jī)械性能，本色料拉伸強(qiáng)度為230MPa。模制塑料主要用于齒輪、輥?zhàn)?、軸承和復(fù)印機(jī)分離爪等。它具有良好的耐燒蝕性能和高溫、高頻下的電磁性，可作飛行器的燒蝕材料、透磁材料和結(jié)構(gòu)材料。它對(duì)金屬和其它材料有很好的粘接性能，適用作漆包線漆、浸漬漆、薄膜、層壓板材、涂層和粘合劑。例如：用它制作的漆包線已用于H級(jí)深水潛水電機(jī)上；層壓板用于印刷線路板和插座；薄膜作絕緣包扎材料。
Polyamide imide with excellent mechanical properties, color material tensile strength of 190MPa. The molded plastic gear is mainly used, roller, bearing and copier separation claw. It has good resistance to electromagnetic ablation resistance and high temperature, high frequency, can be used as a vehicle of ablative material, magnetic material and structural material. It has good bonding properties of metals and other materials, suitable for enameled wire paint, varnish, films, laminates, coatings and adhesives. For example: H has been used for deepwater submersible motor with its production of enameled wire; laminates for printed circuit board and a socket; thin film is used as insulation material.

　　6、開(kāi)發(fā)動(dòng)向
6, development trend

　　取酰胺-酰亞胺與聚均四甲酰亞胺比較，有較低的軟化點(diǎn)和熱變形溫度，有較高的吸水率、相對(duì)介電常數(shù)和介質(zhì)損耗角正切性能。今后發(fā)展方向是增強(qiáng)改性，同其它塑料進(jìn)行合金化，以改善其不利的性能，滿足更多用途的需要。
The amide imide compared with poly pyromellitic diimide, softening point and heat deformation temperature lower, higher water absorption, the relative dielectric constant and dielectric loss angle tangent. Future development direction is to enhance the modification, alloying with other plastics, to improve the bad performance, to meet the need for additional purposes.